Effect of moisture content on thermal properties of cowpea flours

Authors

  • Ajit K. Mahapatra Fort Valley State University
  • Shetelia L. Melton Agricultural Research Station, College of Agriculture, Family Sciences and Technology, Fort Valley State University, 1005 State University Drive, Fort Valley, GA 31030, USA
  • Edwin M. Isang Agricultural Research Station, College of Agriculture, Family Sciences and Technology, Fort Valley State University, 1005 State University Drive, Fort Valley, GA 31030, US

Keywords:

cowpea, Vigna unguiculata, flour, thermal properties, KD2 Pro, moisture content

Abstract

The effects of moisture content on thermal properties of cowpea flour were investigated on a range of 3.81% to 28.31% wet basis at 5% intervals, totaling six moisture levels, using a KD2 Pro Thermal Properties Analyzer.  The considered thermal properties were thermal conductivity, thermal diffusivity, and specific heat.  As the moisture content increased from 3.81% to 28.31 %, the thermal conductivity, thermal diffusivity, and specific heat increased from 0.109 to 0.213 W m-1 K-1, 0.099 to 0.136 mm2 s-1, and 1.092 to 1.573 MJ m-3 K-1, respectively.  The data are necessary for design of equipment for handling, transportation, processing, and storage of cowpea flour.

 

Keywords: cowpea, Vigna unguiculata, flour, thermal properties, KD2 Pro, moisture content

Author Biography

Ajit K. Mahapatra, Fort Valley State University

Assistant Professor, Food & Biosystems Engineering,

College of Agriculture, Family Sciences & Technology

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Published

2013-07-01

Issue

Vol. 15 No. 2 (2013): CIGR Journal

Section

VI-Postharvest Technology and Process Engineering